Indoor lighting involves millions of households, LED lighting is truly popular after the indoor lighting market than the outdoor lighting market is even larger, LED used in indoor lighting, especially atmosphere rendering, with any other light source in the past are unmatched advantages, but In the current domestic market, the price is still too high, and most ordinary people cannot afford it. The cost of LED lighting is mainly in the LED chip. Xu Liancheng pointed out that as long as the price of the chip is reduced, the unit price of LED lumen can be reduced to the energy-saving lamp at the current stage, and indoor lighting will naturally bloom everywhere. LED chips also have significant room for price cuts, among which there are at least the following three ways: 1. Continue to improve light efficiency. In February of this year, Cree has announced that its lab results LED light efficiency has reached 208lm / W, I believe this is not a limitation, there will be room for improvement. 2. The direction of large current toward the large chip. Today's chips are generally between 0.5mm and 1.5mm, and the larger the chip is, the lower the luminous efficiency is, and the chip can't increase the current without high current, which is an obstacle for the development of the LED to a single large power. The development of the large current toward the large chip means that the chip can be made larger without lowering the light efficiency to pass a larger current, so that the power of the single LED is greatly increased (relative to the current 1W), so that the LED used in the lamp is used. The number of light sources will be significantly reduced, helping to reduce the cost of lighting. 3. Develop new substrate materials. The current high-power LED chip substrate materials are generally sapphire or SiC. Both of these materials are very expensive and are monopolized by large foreign companies, causing the chip prices to remain high. In order to break through international patent barriers, research on Si substrate materials has been initiated in China and some progress has been made. Substrate materials made of Si will be much less expensive, not only because the Si substrate itself is much cheaper than sapphire and SiC substrates, but also larger substrates than sapphire and SiC substrates can be produced to increase MOCVD. The utilization rate improves the die yield. Moreover, the Si substrate is also a conductive substrate, and the electrodes can be drawn from both sides of the die without having to lead out from one side like the non-conductive sapphire. This can not only reduce the die area but also eliminate the need for the GaN epitaxial layer. Dry etching step. At the same time, due to the lower hardness of silicon than sapphire and SiC, some costs can be saved in processing. According to estimates of a well-known foreign company, the cost of manufacturing blue GaN LEDs using silicon substrates will be 90% lower than sapphire substrates and SiC substrates. Xu Liancheng said that with the rapid decline in chip prices, I believe that people will soon be able to reach the level acceptable to the people. So now is the time for enterprises to build technology reserves. Only when the basic work is done well can we seize the market first. Xu Liancheng said: "The maturity of LED indoor lighting products and the bottleneck of the price have constrained the development of the market. The real market is the overseas market. First, the foreign electricity bills are high, and there is a large demand for the energy saving of indoor lighting products. The second is related to energy-saving legislation and government. In terms of the domestic market, it is expected that with the development of upstream chips in the next 3 to 5 years, indoor lighting products will occupy 40% of the semiconductor lighting applications.