Intel Releases 3G, LTE Communication Chips

Intel first announced their 3G and LTE chips 6260 and 7060 at MWC. This is the first product after the acquisition of Infineon’s wireless division. The current Apple iPad is using this original XMM from Infineon. 6260 chip.

The XMM 6260 chip demonstrated by Intel this time supports HSPA+ network. The upstream and downstream speeds can reach 11.5Mbps, 21Mbps and 40nm respectively. The X-GOLD 626 baseband processor and SMARTi UE2 RF transceiver are used.

The XMM 7060 platform is a more advanced product. It supports 2G, 3G and LTE networks. It uses X-GOLD generations of processors and SMARTi 4G multimode RF transceivers to implement 5-band LTE, 5-band 3G and 4-band simultaneously. 2G communication.