Guangdong LED package MOCVD equipment patent analysis re-warning

After July of this year, Guangdong reopened the patent analysis and early warning of LED packaging MOCVD equipment. On the afternoon of November 14, the core patent analysis and early warning report conference organized by the Guangdong Provincial Intellectual Property Office in the field of LED industry packaging and MOCVD equipment was held in Zhongshan. More than 100 LED packaging engineering technologies and company executives from Guangdong Province were held. The representatives of the industry organization heard the analysis and early warning report. Unlike the LED lighting MOCVD equipment patent analysis and early-warning report held in July this year, which is led by the consultation of the Sun Yat-sen University, the analysis and early warning is undertaken by South China Normal University.

According to a report by Fan Guanghan, a professor at the South China Normal University Institute of Optoelectronic Materials and Technology, in the field of LED packaging, China’s number of original patent applications is ahead of other countries, followed by the Japanese team, with the United States and South Korea ranking fourth and fourth. The R&D strength of LED packaging in foreign countries is not only focused on the structure, but also has great research on packaging materials. However, China mainly concentrates on the design of LED package structures. When a better material is used, it is easily subject to human control.

In addition, foreign applications for packaging processes and structures are focused on quality. Once high-quality patents are available, they will apply for patents of the same family to various countries through PCT and other channels, and China is their main target market. From the current domestic structure of most thermoelectric separations, it can be seen that the number of applications for packaging structure in China is very large, but it does not go to the world. From some angles, it can be seen that it has its own patent quality. Not confident.

The world's top 10 Philips, Samsung, Cree, LG, Panasonic and other famous manufacturers, applied for a total of 5263 patents, this is the applicant's future is still the main competitors in the packaging field. In contrast, the top three Chinese applicants are Taiwan Everlight Electronics Industry Co., Ltd., Hongqi Technology Co., Ltd. and Yiyi Precision Industry Co., Ltd., which accounted for 18%, 13%, and 11 of the top 10 applications in China respectively. %, indicating that Taiwan has impressive strength in the packaging field. In the future, Taiwan's LED packaging peers will remain a strong competitor. The top 6 patent applicants on the mainland are Heshan Lide Electronic Industry Co., Ltd., Foshan Guoxing Optoelectronics Co., Ltd., Tsinghua University, Electronic Science and Technology University, Guangzhou Nanke Integrated Electronics Co., Ltd., and Rainbow Group.

The report also shows that in the field of MOCVD, from the application trends of the five major original countries or regions in the United States, Japan, South Korea and Germany, and Taiwan of China, except for the United States and Japan that started earlier, the other three countries and regions all have It began in the mid-1990s. Although individual start-ups of these five countries and regions were relatively early, the overall patent situation has been consistent since 2000, and the number of applications has grown rapidly.

China started relatively late, and the number of patents in this area is still small, the originality and quality are not ideal, and there is no advantage. AIXTRON of Germany and VEECO of USA have leading advantages in MOCVD technology, occupying 90% of the world's market share. Their core patents cover the design of the growth reaction chamber, heating, stage design, etc., both in China and worldwide. Patent layout is the core technical point of MOCVD equipment.