Saw Resonator--HDR430.5M-B13 Chip Size Package 2.0*1.6mm with better price can replace of 3*3mm DCC6C and DIP Typ

 The strong point  for CSP(chip size package) resonator (HDR430.5M-B13).
 

1. Adopting the most advanced flip chip technology, flipping the chip on the package after bump bonding , then using the ultrasonic  technology to connect the input and output pin.

This process can greatly reduce the fault rate caused by circuit-short or  circuit-break.

 

2. Chip-size package-- SMD 2.0*1.6mm.

They can meet the needs of miniaturized products.

 

3. Competitive price.  

As real SMD-type resonator ,  their price is only half of similar  SMD3030 or SMD 5035 series , 

They can be used as a low-cost solution for the users, while greatly reduce the labor costs of traditional DIP series.

 

 4. Large manufacturing capacity  and Short Lead Time . 

Our lead time for CSP resonator is only one week, because they are produced by fully automatic equipment.

 
























 

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