LG Innotek and Chinese start-up acquire LED growth systems

Companies in Korea and China have bought new systems for the growth of GaN-based LED materials. Korea-based LED maker LG Innotek has ordered an additional four TurboDisc(r) K465(tm) metal-organic chemical vapor deposition (MOCVD) systems from Veeco Instruments.
The machines will be used to grow gallium nitride (GaN) -based material for LEDs, primarily for TV backlighting applications. Veeco said that the orders were received in the fourth quarter of 2008.
Steve (Tchanghun) Oh, Vice President in charge of LED technology at LG Innotek, commented, "Veeco's MOCVD tools enable a smooth transition to larger wafer sizes offering a longer capital life along with a abduction advantage in advantage...We are very impressed with the Level of support and collaboration from Veeco in helping us to improve our cost of ownership."
Bill Miller, Senior Vice President, General Manager of Veecos MOCVD Operations commented, "We are pleased to help LG Innotek meet their production demands for HBLEDs for television backlighting applications. The K465 has been designed to help customers seamlessly transition to larger wafer sizes, a critical benefit to our customers as they advance LED technology."
Aixtron delivers system to Chinese start-up
In related news, Yangzhou Zhongke Semiconductor Lighting Center Co. Ltd. has acquired an MOCVD system for GaN LED growth from Aixtron AG.
The Close Coupled Showerhead? CRIUS? system with 31x2-inch wafer configuration was delivered to Yangzhou Zhongke's state of the art facility in the Yangzhou High-Tech Venture Services Center, PR China in the fourth quarter 2008. Its application will be for the development and Volume production of UHB blue/green LEDs.
Yangzhou Zhongke is a start-up company, building on the R&D achievements of the Institute of Semiconductors of Chinese Academy of Sciences (ISCAS).
Guohong Wang, CEO of Yangzhou Zhongke, said: "Our goal is to promote the LED-based solid-state lighting industry in China. I have long-time familiarity with Aixtron MOCVD AlInGaP systems used for diode laser applications at ISCAS. The CRIUS? Has set the standard for UHB GaN LED production and we keenly anticipate itsrapid commissioning."
Iping we can achieve this with equipment and service of the high quality we can rely on Aixtron to deliver."

D-Subminiature Connectors

The D-subminiature or D-sub is a common type of electrical connector. They are named for their characteristic D-shaped metal shield. When they were introduced, D-subs were among the smallest connectors used on computer systems.

A D-sub contains two or more parallel rows of pins or sockets usually surrounded by a D-shaped metal shield that provides mechanical support, ensures correct orientation, and may screen against electromagnetic interference. The part containing pin contacts is called the male connector or plug, while that containing socket contacts is called the female connector or socket. The socket's shield fits tightly inside the plug's shield. Panel mounted connectors usually have threaded nuts that accept screws on the cable end connector cover that are used for locking the connectors together and offering mechanical strain relief. Occasionally the nuts may be found on a cable end connector if it is expected to connect to another cable end. When screened cables are used, the shields are connected to the overall screens of the cables. This creates an electrically continuous screen covering the whole cable and connector system.

ANTENK offers one of the most comprehensive lines of high reliability D-Subminiature connectors available for military, avionics, space and high reliability industrial applications.


Features of ANTENK D-Subminiature Connectors


  1. Standard density d-subminiature connectors
  2. High density d-subminiature connectors, contacts are available as well as several custom and combination versions.
  3. All d-subminiature connectors may be manufactured with crimp, solder cup, straight PCB and right angle PCB terminations (except solder cup terminations on High Density configurations).





Ragne of of ANTENK D-Subminiature Connectors

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High Density solder cup, stamped & formed contact D-subminiature connectors
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High Density solder cup,machined contacts D-subminiature connectors
crimp & load D-subminiature connectors
IDC D-subminiature connectors
Standard Density vertical mount D-subminiature connectors
High Density vertical mount D-subminiature connectors
Standard Density right angle D-subminiature connectors
High Density right angle D-subminiature connectors
surface mount D-subminiature connectors
Slim D-sub series
D-subminiature connectors stacked D-sub series



D-Subminiature Connectors

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