Apple released the iPhone, iPadPro, AppleTV and the new generation AppleWatch operating system at the recent new product launch conference. It is the most abundant product in the past years. This article will mainly make the main core chips of iPhone products that account for more than 60% of Apple's revenue. These discussions include processors, memory and wireless communication chips. This generation of iPhone continues the past traditionally named iPhone6s, maintaining the same 4.7-inch and 5.5-inch appearance as the iPhone6 ​​in appearance, and the resolution is also unchanged, so the screen PPI is also the same. The biggest feature of iPhone6s is the addition of 3DTouch. The ForceTouch function used by AppleWatch has been continuously improved to increase the user experience (UserExperience) effect. In addition to the original iPhone6 ​​color, the appearance color is the same as the past rumors. Rose gold. The resolution of the main camera module has also increased dramatically to 12 million pixels for the main camera, and the front camera has also increased to 5 million pixels. While playing the chip part of the iPhone's core core computing functions, the following will discuss the biggest difference from the previous generation iPhone6. A9 uses a new transistor architecture The new A9 application processor (ApplicaTIonProcessor/AP) in the iPhone6s adopts the new transistor architecture (New Transistor Architecture). Since the A8 processor in the iPhone 6 is a 20 nm bulk transistor process using TSMC, the so-called new transistor architecture is likely to be a fin transistor (FinFET). The foundry is 16nm from TSMC or 14nm from Samsung. As the transistor process continues to shrink, the gate oxide layer (GateOxide) becomes thinner and thinner, and the current leaking from the gate level will become larger and larger, posing a serious threat to the standby time of the personal mobile device. The FinFET utilizes multidimensional ( mulTI) or 3D gate to control current. Intel has started using FinFETs at 2Xnm and is now fully commercialized into its microprocessor products. TSMC and Samsung have fully introduced FinFETs at 1Xnm. A9 performance upgrade Apple said that the A9's central processing unit (Central Processing Unit/CPU) will be 70% faster than the A8. Since the A9 should still use the same ARMv8 instruction level architecture as the A8, the A9 is likely to use the same 3 core as the iPad Air2's A8X. The A9's Graphic Processing Unit (GPU), according to Apple's claim that the performance will be 90% higher than the A8, it should probably also be the same as the A8X with the 8 core customized (CustomizaTIon) PowerVR architecture, the main feature of the A9 is The introduction of FinFET reduces area and improves heat dissipation, plus circuit optimization to achieve full performance upgrades. Increased memory and support for 4K recording The iPhone6s rear-master lens supports 4K video. The 4K resolution is 4 times that of FullHD (2&TImes; 2), and the Pixel can reach 8 million. Since the storage capacity of the mobile phone is not as large as that of a large video or a monocular device, it is usually subjected to basic compression processing, such as DCT, and the original AP usually integrates the CPU and the GPU. The DRAM in the mobile phone needs to share the traditional main memory and the FrameBuffer. In addition, the traditional operating needs of the operating system, iPhone6s on the overall mobile phone volatile memory demand increased, so the iPhone6s internal DRAM usage is likely to increase from the original iPhone6 ​​1GBLPDDR3 to 2GBLPDDR4.
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