Making biochips is a key technology for disease research and is now becoming easier. The new nano-printing process uses gold-plated pyramids, LED light sources, and photochemical reactions to print more organic material on the surface of a single biochip than ever before. Equipment appearance The technology uses a series of polymer pyramids that are covered in gold and mounted on an atomic force microscope. These 1cm square arrays contain thousands of small pyramids with holes that allow light to pass through, and ensure that light passes through only specific locations on the surface of the chip, holding delicate organic matter to the surface of the chip and not Damage them. Such sophisticated lithography processes are widely considered to be the best way to use nanoscale 3D printing of organic materials. But in the past, they were limited in that they could only print one molecule at a time. Chip to be printed Now researchers at the University of New York City Advanced Research Center (ASRC) and Hunt College believe they have solved this problem. Printing principle They are using microfluidic technology, which manipulates fluids at the molecular level and delivers the desired combination of compounds to designated locations on the biochip. Then they use photochemical reactions, that is, light passes through the small pyramid mentioned earlier. When light reacts with molecules, it sticks them on the chip. With a typical lithography system, the energy of light can be overloaded, destroying some molecules. However, the City University of New York team used beam lithography to limit the light to a small vertex. This allows the team to control the light and protect the organic material that has been printed on the biochip. Adam Braunschweig, associate researcher at the ASRC Nanoscience Initiative and the Department of Chemistry at Hunt College, said that this 3D printed biochip approach will allow scientists to understand the fast lanes of cells and organisms. This is because this technology should make it easier and more effective to study the development of diseases and solve other biological problems, such as detecting bioterrorism drugs. PGA Sockets Pin Grid Array Socket
Antenk's processor socket line is designed for use with Intel- and AMD-based microprocessor packages. Socket types include land grid array (LGA), micro pin grid array (mPGA), and PGA with low to zero insertion force. The mPGA and PGA sockets are designed for various microprocessor packages for notebook PCs, desktop PCs, and servers. For custom applications, the compression sockets can be configured to the specific application.
Pin Grid Array (PGA) Sockets Type
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A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).
PGA Sockets & Adapters
Low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns.
PGA Sockets & Adapters Overview
Durable construction for virtually any application
Wide variety of materials, lengths, and sizes
Cost-effective method for replacing, repairing, or upgrading PGA devices
Unique options such as solder preform terminals eliminate the need for wave soldering in mixed SMT/Thru-hole applications
RoHS compliant insulators and screw-machined terminals are compatible with lead-free processing - select either Matte Tin/Gold (MG) or Gold/Gold (GG) plating
Antenk's Pin Grid Array (PGA) Sockets
Complex printed circuits are too valuable to risk direct soldering to expensive integrated circuits (ICs). Using a socket is the answer. The use of sockets offers advantages that prove cost effective and simplify board design.
These sockets provide a zero insertion force (ZIF) PGA interface to the microprocessor PGA package and are attached to the PCB with surface-mount technology (SMT) soldering. PGA sockets are available in arrays up to 989 positions with single lever, screw driver, and hex wrench actuation methods.
PGA Sockets (LIF)
These sockets are primarily employed for microprocessor package test applications using through-hole solder attachment to the PCB design. The contacts are screw-machine outer sleeves with either stamped and formed or drawn inner contacts. Custom arrays are available in more than 1,000 positions.
mPGA
PGA
Eliminate hand-loading of pins, facilitate solder joint visibility, low profile component mounting or board mating.