Thermal part: circuit substrate, caulking material, housing material Heat sink: shell design, surface design, surface material Next, Xiaobian compiled the advantages and disadvantages of these materials, you are welcome to join to discuss. Thermal part Circuit substrate Fiberglass board advantage: Low cost and easy to make No need to consider insulation properties Disadvantages: Not suitable for LED design with heat sink and electrode Need to fill the hole with tin, increase the process Thick copper foil layer is needed to increase heat transfer efficiency Aluminum plate advantage: Generally accepted Harder than FR4, better thermal conductivity with heat sink Electrical insulation is higher than fiberglass board Disadvantages: The price is higher than FR4 Less able to place other electronic components on the substrate The thermal conductivity of the insulation layer is difficult to grasp Copper substrate advantage: Thermal conductivity is much higher than aluminum substrate Low specific heat value, easier to pull up the conduction temperature Same advantages as aluminum substrates Disadvantages: High cost, general design is not applicable Has the same disadvantages as aluminum substrates
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