[Brand Power·LUMILEDS] CSP leads the new transformation in the packaging industry

Chip-scale packaging (CSP) is optimistic by many packaging companies due to the simplicity, miniaturization, and possibly lowering the material cost of each device. At present, many LED companies have begun to get involved in CSP packaging. The industry believes that the emergence of CSP may be expected to cause a new round of packaging industry changes.

Lumileds senior sales manager Wen Xinghua mentioned in the high-tech LED tour Foshan station speech that in order to reduce costs, all current LED device development trends are moving toward miniaturization, because only device miniaturization can improve cost performance, based on CSP It can meet the requirements of miniaturized packaging and will have a very large market space in the future.

Lumileds Senior Sales Manager Wen Xinghua

Wen Xinghua pointed out that the application field of CSP packaging will be very extensive, and the most worth mentioning is the field of TV backlighting. In TV applications, the brightness of traditional medium power devices has not been able to meet the requirements of 4K TVs.

"Currently, the backlighting scheme for making large screens is being considered using CSP packaging, which not only helps to drive down the cost, but more importantly, with the popularity of CSP in the backlight field, it will also drive its entry into the lighting market. The speed will be faster." Wen Xinghua said.

In addition, Wen Xinghua said that street lighting modularization is also a trend in the future, which will bring flexibility to application companies and facilitate supply chain management, while modularization can better promote the development of devices in the direction of standardization. “In South Korea, there are weight restrictions on the module, including how many LEDs are needed on the street lamp. The size of the lamp head is specified. The CSP package will further promote the streetlight moduleization with higher integration capability. Great benefit."

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